Submission of abstracts to the 15th International Congress on Thermal Stresses at IIT Delhi will open on 1st January 2027. Authors who wish to contribute a paper are requested to submit a one-page (about 500 words) abstract online. Once the abstract is accepted, authors may submit an 8-page full paper for publication in the conference proceedings. ICTS 2027 will highlight cutting-edge developments across thermal stresses, with particular focus on the following-
CFP Topics/Tracks
Thermal Stresses and Deformations
Thermoelasticity, Thermo-Viscoelasticity, and Thermoplasticity
Thermal Stresses in Smart Materials
Thermal Stresses in Contact Mechanics
Thermal Stresses in Dynamic Problems
Thermal Fracture and Fatigue of Heterogeneous Materials
Thermal Stresses in Manufacturing
Thermo-Hygro-Mechanics
Thermo-Biomechanics
Thermal Shock
Continuum Thermomechanics
Experimental Thermomechanics
Computational Thermomechanics
Control of Thermal Stresses
Instability and Localization under Thermomechanical Loading
Inverse and optimization problems in thermomechanics
Thermal Stresses in Composites
Thermomechanics for Structural Health Monitoring
Multiscale Thermomechanics
Machine Learning-Assisted Thermomechanics
